| Part No. | Manufacturer | Description | Lead Time | Unit Price(USD） | In Stock | Quantity | Operation |
|---|---|---|---|---|---|---|---|
MKP385E3122BKI02W0
| Vishay |
CAP FILM 0.012UF 10% 2.5KVDC RAD
| MPQ: 300 Lead Time: 9-12Days | -- -- | 2300 | Total:
$
| |
ATS-PCBT1086
| Advanced Thermal Solutions Inc |
HEATSINK TO-220 W/TAB BLACK
| MPQ: 100 Lead Time: 9-12Days | -- -- | 900 | Total:
$
| |
634-10ABP
| Wakefield-Vette |
HEATSINK TO-220 VERT MT BLK 1"
| MPQ: 1100 Lead Time: 9-12Days | -- -- | 8300 | Total:
$
| |
MKP385E3222AKF02W0
| Vishay |
CAP FILM 0.022UF 10% 2KVDC RAD
| MPQ: 550 Lead Time: 9-12Days | -- -- | 9200 | Total:
$
| |
MKP385E41212KII2B0
| Vishay |
CAP FILM 0.12UF 10% 1.25KVDC RAD
| MPQ: 200 Lead Time: 9-12Days | -- -- | 7700 | Total:
$
| |
ATS-PCBT1080
| Advanced Thermal Solutions Inc |
HEATSINK TO-218/TO-220 BLACK
| MPQ: 100 Lead Time: 9-12Days | -- -- | 3200 | Total:
$
| |
MKP385E41212KIM2T0
| Vishay |
CAP FILM 0.12UF 10% 1.25KVDC RAD
| MPQ: 150 Lead Time: 9-12Days | -- -- | 5300 | Total:
$
| |
HSE-B18254-0396H
| Cui Devices |
HEAT SINK, EXTRUSION,TO-218, 25.
| MPQ: 600 Lead Time: 9-12Days | -- -- | 1500 | Total:
$
| |
DTC114TCAHZGT116
| Rohm Semiconductor |
TRANS PREBIAS NPN 50V 0.1A SST3
| MPQ: 3000 Lead Time: 9-12Days | -- -- | 6000 | Total:
$
| |
MKP385E41212KIP2T0
| Vishay |
CAP FILM 0.12UF 10% 1.25KVDC RAD
| MPQ: 150 Lead Time: 9-12Days | -- -- | 8100 | Total:
$
| |
HSE-B18254-035H-00
| Cui Devices |
HEAT SINK, EXTRUSION, TO-218, 25
| MPQ: 750 Lead Time: 9-12Days | -- -- | 6400 | Total:
$
| |
DTC124EUBHZGTL
| Rohm Semiconductor |
TRANS PREBIAS NPN 0.1A UMT3F
| MPQ: 3000 Lead Time: 9-12Days | -- -- | 5300 | Total:
$
| |
MKP385E3272AJI02W0
| Vishay |
CAP FILM 0.027UF 5% 2KVDC RAD
| MPQ: 350 Lead Time: 9-12Days | -- -- | 9400 | Total:
$
| |
ATS-PCBT1077
| Advanced Thermal Solutions Inc |
HEATSINK TO-220 BLACK W/TAB
| MPQ: 100 Lead Time: 9-12Days | -- -- | 7200 | Total:
$
| |
MKP385E38212JI02W0
| Vishay |
CAP FILM 0.08UF 5% 1.25KVDC RAD
| MPQ: 350 Lead Time: 9-12Days | -- -- | 4200 | Total:
$
| |
HSE-B18254-035H
| Cui Devices |
HEAT SINK, EXTRUSION, TO-218, 25
| MPQ: 750 Lead Time: 9-12Days | -- -- | 9700 | Total:
$
| |
DTC143EUBHZGTL
| Rohm Semiconductor |
TRANS PREBIAS NPN 0.1A UMT3F
| MPQ: 3000 Lead Time: 9-12Days | -- -- | 6300 | Total:
$
| |
F340Y235630MFI2B0
| Vishay |
CAP FILM 0.056UF 20% 1KVDC RAD
| MPQ: 500 Lead Time: 9-12Days | -- -- | 9800 | Total:
$
| |
DTC144EUBHZGTL
| Rohm Semiconductor |
TRANS PREBIAS NPN 0.1A UMT3F
| MPQ: 3000 Lead Time: 9-12Days | -- -- | 8900 | Total:
$
| |
HSE-B20250-045H
| Cui Devices |
HEAT SINK, EXTRUSION, TO-220, 50
| MPQ: 1080 Lead Time: 9-12Days | -- -- | 4100 | Total:
$
|
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