| Part No. | Manufacturer | Description | Lead Time | Unit Price(USD） | In Stock | Quantity | Operation |
|---|---|---|---|---|---|---|---|
ATS-56002-C4-R0
| Advanced Thermal Solutions Inc |
HEAT SINK 25MM X 25MM X 4MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 100 | Total:
$
| |
ADUM241D1BRWZ
| Analog Devices |
DGTL ISOLTR 5KV 4CH GP 16-SOIC
| MPQ: 47 Lead Time: 9-12Days | -- -- | 900 | Total:
$
| |
ATS-1178-C1-R0
| Advanced Thermal Solutions Inc |
1/8 BRICK HEATSINK 58X23X6.1MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 2900 | Total:
$
| |
ATS-54350R-C1-R0
| Advanced Thermal Solutions Inc |
HEAT SINK 35MM X 35MM X 19.5MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 9900 | Total:
$
| |
TG-CJ-LI-60-60-15-PF
| T-Global Technology |
HEATSINK CER 60X60X15MM W/TAPE
| MPQ: 1 Lead Time: 9-12Days | -- -- | 3200 | Total:
$
| |
ATS-EXL58-300-R0
| Advanced Thermal Solutions Inc |
HEATSINK AL6063 300X6X8MM
| MPQ: 1 Lead Time: 9-12Days | -- -- | 6900 | Total:
$
| |
375024B00032G
| Boyd |
HEATSINK BGA W/ADHESIVE TAPE
| MPQ: 450 Lead Time: 9-12Days | -- -- | 8700 | Total:
$
| |
ADUM5211BRSZ
| Analog Devices |
DGTL ISOLTR 2.5KV 2CH GP 20-SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 6200 | Total:
$
| |
ADUM3154BRSZ
| Analog Devices |
DGTL ISO 3.75KV 4CH SPI 20-SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 7600 | Total:
$
| |
APF40-40-13CB
| Cts |
HEATSINK LOW-PROFILE FORGED
| MPQ: 300 Lead Time: 9-12Days | -- -- | 7100 | Total:
$
| |
ADUM3471ARSZ
| Analog Devices |
DGTL ISOLTR 2.5KV 4CH GP 20-SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 3700 | Total:
$
| |
ATS-52230B-C1-R0
| Advanced Thermal Solutions Inc |
HEAT SINK 23MM X 23MM X 7.5MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 3600 | Total:
$
| |
ADUM1200WURZ
| Analog Devices |
DGTL ISOLTR 2.5KV 2CH GP 8-SOIC
| MPQ: 98 Lead Time: 9-12Days | -- -- | 6200 | Total:
$
| |
ISO35DW
| Texas Instruments |
DG ISO 2.5KV 3CH RS422 16-SOIC
| MPQ: 40 Lead Time: 9-12Days | -- -- | 3100 | Total:
$
| |
MAX14938GWE+
| Analog Devices |
DG ISO 2.75KV 3CH RS485 16-SOIC
| MPQ: 46 Lead Time: 9-12Days | -- -- | 5700 | Total:
$
| |
532602B02500G
| Boyd |
HEATSINK TO-220 SOLDERPIN 38.1MM
| MPQ: 240 Lead Time: 9-12Days | -- -- | 4300 | Total:
$
| |
OMNI-UNI-18-50
| Wakefield-Vette |
HEATSINK 18X50MM TO-247 TO-264
| MPQ: 1000 Lead Time: 9-12Days | -- -- | 6400 | Total:
$
| |
ADUM5211CRSZ
| Analog Devices |
DGTL ISOLTR 2.5KV 2CH GP 20-SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 6000 | Total:
$
| |
374024B00035G
| Boyd |
HEATSINK BGA 23X23X10MM W/ADH
| MPQ: 480 Lead Time: 9-12Days | -- -- | 9900 | Total:
$
| |
ATS-CPX060060025-132-C1-R0
| Advanced Thermal Solutions Inc |
HEATSINK 60X60X25MM XCUT CP
| MPQ: 25 Lead Time: 9-12Days | -- -- | 8400 | Total:
$
|
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