Profile:
TE Connectivity Ltd., with its stock traded on the New York Stock Exchange under the ticker symbol TEL, is a global leader in designing and manufacturing a diverse range of products that connect and protect the flow of power and data in everyday devices. The company has been operating under various names, including Tyco Electronics, before adopting its current name in 2011 to better reflect its offerings and solutions.
| Part No. | Manufacturer | Description | Lead Time | Unit Price(USD） | In Stock | Quantity | Operation |
|---|---|---|---|---|---|---|---|
ADUM3301CRWZ
| Analog Devices |
DGTL ISOLTR 2.5KV 3CH GP 16-SOIC
| MPQ: 47 Lead Time: 9-12Days | -- -- | 6700 | Total:
$
| |
ADUM3401WARWZ
| Analog Devices |
DGTL ISOLTR 2.5KV 4CH GP 16-SOIC
| MPQ: 47 Lead Time: 9-12Days | -- -- | 7500 | Total:
$
| |
ATS-51330K-C1-R0
| Advanced Thermal Solutions Inc |
HEAT SINK 33MM X 33MM X 14.5MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 6300 | Total:
$
| |
ADUM1445ARSZ
| Analog Devices |
DGTL ISOLTR 3.75KV 4CH GP 20SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 7700 | Total:
$
| |
ATS-P2-27-C2-R0
| Advanced Thermal Solutions Inc |
HEATSINK 70X70X12.7MM XCUT T766
| MPQ: 25 Lead Time: 9-12Days | -- -- | 9500 | Total:
$
| |
ADUM3153BRSZ
| Analog Devices |
DGTL ISO 3.75KV 7CH SPI 20-SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 9700 | Total:
$
| |
ATS-51325K-C1-R0
| Advanced Thermal Solutions Inc |
HEAT SINK 32.5 X 32.5 X 14.5MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 8100 | Total:
$
| |
ATS-P2-42-C2-R0
| Advanced Thermal Solutions Inc |
HEATSINK 57.9X60.96X22.86MM T766
| MPQ: 25 Lead Time: 9-12Days | -- -- | 1900 | Total:
$
| |
MAX14932DASE+
| Analog Devices |
DGTL ISOLTR 2.75KV 4CH GP 16SOIC
| MPQ: 50 Lead Time: 9-12Days | -- -- | 7800 | Total:
$
| |
ATS-H1-22-C2-R0
| Advanced Thermal Solutions Inc |
HEATSINK 60X60X12.7MM XCUT T766
| MPQ: 25 Lead Time: 9-12Days | -- -- | 8100 | Total:
$
| |
ATS-H1-110-C2-R1
| Advanced Thermal Solutions Inc |
HEATSINK 54.00MM X 54.00MM ALUM
| MPQ: 25 Lead Time: 9-12Days | -- -- | 5600 | Total:
$
| |
MAX14931AAWE+
| Analog Devices |
DGTL ISOLTR 2.75KV 4CH GP 16SOIC
| MPQ: 46 Lead Time: 9-12Days | -- -- | 300 | Total:
$
| |
ATS-1103-C1-R0
| Advanced Thermal Solutions Inc |
1/2 BRICK HEATSINK 61X58X6.1MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 6300 | Total:
$
| |
MAX14932CAWE+
| Analog Devices |
DGTL ISOLTR 2.75KV 4CH GP 16SOIC
| MPQ: 46 Lead Time: 9-12Days | -- -- | 3000 | Total:
$
| |
ATS-53450R-C1-R0
| Advanced Thermal Solutions Inc |
HEAT SINK 45MM X 45MM X 19.5MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 4800 | Total:
$
| |
ADUM6210BRSZ
| Analog Devices |
DGTL ISOLTR 3.75KV 2CH GP 20SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 9900 | Total:
$
| |
ATS-H1-21-C2-R0
| Advanced Thermal Solutions Inc |
HEATSINK 60X60X10MM XCUT T766
| MPQ: 25 Lead Time: 9-12Days | -- -- | 1900 | Total:
$
| |
LTM2810CY-S#PBF
| Analog Devices |
DGTL ISOLTR 7.5KV 6CH SPI 36-BGA
| MPQ: 120 Lead Time: 9-12Days | -- -- | 8900 | Total:
$
| |
ATS-51300K-C1-R0
| Advanced Thermal Solutions Inc |
HEAT SINK 30MM X 30MM X 14.5MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 2400 | Total:
$
| |
LTM2810IY-I#PBF
| Analog Devices |
DGTL ISOLTR 7.5KV 6CH I2C 36-BGA
| MPQ: 160 Lead Time: 9-12Days | -- -- | 3600 | Total:
$
|
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