Profile:
TE Connectivity Ltd., with its stock traded on the New York Stock Exchange under the ticker symbol TEL, is a global leader in designing and manufacturing a diverse range of products that connect and protect the flow of power and data in everyday devices. The company has been operating under various names, including Tyco Electronics, before adopting its current name in 2011 to better reflect its offerings and solutions.
| Part No. | Manufacturer | Description | Lead Time | Unit Price(USD） | In Stock | Quantity | Operation |
|---|---|---|---|---|---|---|---|
ADUM5210CRSZ
| Analog Devices |
DGTL ISOLTR 2.5KV 2CH GP 20-SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 9000 | Total:
$
| |
ADUM4402ARIZ
| Analog Devices |
DGTL ISOLTR 5KV 4CH GP 16-SOIC
| MPQ: 37 Lead Time: 9-12Days | -- -- | 0 | Total:
$
| |
ATS-X53330P-C1-R0
| Advanced Thermal Solutions Inc |
SUPERGRIP HEATSINK 33X33X17.5MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 3800 | Total:
$
| |
ADUM6210ARSZ
| Analog Devices |
DGTL ISOLTR 3.75KV 2CH GP 20SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 4100 | Total:
$
| |
ATS-H1-42-C2-R0
| Advanced Thermal Solutions Inc |
HEATSINK 57.9X60.96X22.86MM T766
| MPQ: 25 Lead Time: 9-12Days | -- -- | 1500 | Total:
$
| |
ADUM3471WARSZ
| Analog Devices |
DGTL ISOLTR 2.5KV 4CH GP 20-SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 9300 | Total:
$
| |
ATS-56007-C4-R0
| Advanced Thermal Solutions Inc |
HEAT SINK 45MM X 45MM X 15MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 2600 | Total:
$
| |
ACML-7410-000E
| Broadcom(Avago) |
DGTL ISOLTR 5.6KV 4CH GP 16-SOIC
| MPQ: 45 Lead Time: 9-12Days | -- -- | 5500 | Total:
$
| |
ISO7820LLDW
| Texas Instruments |
DGTL ISOLTR 5.7KV 2CH GP 16-SOIC
| MPQ: 40 Lead Time: 9-12Days | -- -- | 6800 | Total:
$
| |
ADUM5201WCRWZ
| Analog Devices |
DGTL ISOLTR 2.5KV 2CH GP 16-SOIC
| MPQ: 47 Lead Time: 9-12Days | -- -- | 7900 | Total:
$
| |
ATS-56006-C4-R0
| Advanced Thermal Solutions Inc |
HEAT SINK 50MM X 45MM X 12.5MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 3200 | Total:
$
| |
ATS-H1-41-C2-R0
| Advanced Thermal Solutions Inc |
HEATSINK 57.9X60.96X17.78MM T766
| MPQ: 25 Lead Time: 9-12Days | -- -- | 7200 | Total:
$
| |
LTM2892CY-S#PBF
| Analog Devices |
DGTL ISOLTR 3.5KV 6CH SPI 24BBGA
| MPQ: 260 Lead Time: 9-12Days | -- -- | 9800 | Total:
$
| |
LTM2892HY-S#PBF
| Analog Devices |
DGTL ISOLTR 3.5KV 6CH SPI 24BBGA
| MPQ: 260 Lead Time: 9-12Days | -- -- | 8600 | Total:
$
| |
ATS-X53290P-C1-R0
| Advanced Thermal Solutions Inc |
SUPERGRIP HEATSINK 29X29X17.5MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 1000 | Total:
$
| |
LTM2893CY#PBF
| Analog Devices |
DGTL ISOLTR 6KV 9CH SPI 36-BGA
| MPQ: 160 Lead Time: 9-12Days | -- -- | 6200 | Total:
$
| |
LTM2893IY-1#PBF
| Analog Devices |
DGTL ISOLTR 6KV 10CH SPI 36-BGA
| MPQ: 160 Lead Time: 9-12Days | -- -- | 5000 | Total:
$
| |
LTM2886CY-5I#PBF
| Analog Devices |
DGTL ISOLTR 2.5KV 6CH I2C 32BBGA
| MPQ: 119 Lead Time: 9-12Days | -- -- | 8300 | Total:
$
| |
LTM2887CY-5S#PBF
| Analog Devices |
DGTL ISOLTR 2.5KV 6CH SPI 32BBGA
| MPQ: 119 Lead Time: 9-12Days | -- -- | 7100 | Total:
$
| |
ATS-H1-30-C2-R0
| Advanced Thermal Solutions Inc |
HEATSINK 70X70X25MM XCUT T766
| MPQ: 25 Lead Time: 9-12Days | -- -- | 2400 | Total:
$
|
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