Profile:
TE Connectivity Ltd., with its stock traded on the New York Stock Exchange under the ticker symbol TEL, is a global leader in designing and manufacturing a diverse range of products that connect and protect the flow of power and data in everyday devices. The company has been operating under various names, including Tyco Electronics, before adopting its current name in 2011 to better reflect its offerings and solutions.
| Part No. | Manufacturer | Description | Lead Time | Unit Price(USD） | In Stock | Quantity | Operation |
|---|---|---|---|---|---|---|---|
ATS-54350R-C1-R0
| Advanced Thermal Solutions Inc |
HEAT SINK 35MM X 35MM X 19.5MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 9900 | Total:
$
| |
TG-CJ-LI-60-60-15-PF
| T-Global Technology |
HEATSINK CER 60X60X15MM W/TAPE
| MPQ: 1 Lead Time: 9-12Days | -- -- | 3200 | Total:
$
| |
ATS-EXL58-300-R0
| Advanced Thermal Solutions Inc |
HEATSINK AL6063 300X6X8MM
| MPQ: 1 Lead Time: 9-12Days | -- -- | 6900 | Total:
$
| |
375024B00032G
| Boyd |
HEATSINK BGA W/ADHESIVE TAPE
| MPQ: 450 Lead Time: 9-12Days | -- -- | 8700 | Total:
$
| |
ADUM5211BRSZ
| Analog Devices |
DGTL ISOLTR 2.5KV 2CH GP 20-SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 6200 | Total:
$
| |
ADUM3154BRSZ
| Analog Devices |
DGTL ISO 3.75KV 4CH SPI 20-SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 7600 | Total:
$
| |
APF40-40-13CB
| Cts |
HEATSINK LOW-PROFILE FORGED
| MPQ: 300 Lead Time: 9-12Days | -- -- | 7100 | Total:
$
| |
ADUM3471ARSZ
| Analog Devices |
DGTL ISOLTR 2.5KV 4CH GP 20-SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 3700 | Total:
$
| |
ATS-52230B-C1-R0
| Advanced Thermal Solutions Inc |
HEAT SINK 23MM X 23MM X 7.5MM
| MPQ: 100 Lead Time: 9-12Days | -- -- | 3600 | Total:
$
| |
ADUM1200WURZ
| Analog Devices |
DGTL ISOLTR 2.5KV 2CH GP 8-SOIC
| MPQ: 98 Lead Time: 9-12Days | -- -- | 6200 | Total:
$
| |
ISO35DW
| Texas Instruments |
DG ISO 2.5KV 3CH RS422 16-SOIC
| MPQ: 40 Lead Time: 9-12Days | -- -- | 3100 | Total:
$
| |
MAX14938GWE+
| Analog Devices |
DG ISO 2.75KV 3CH RS485 16-SOIC
| MPQ: 46 Lead Time: 9-12Days | -- -- | 5700 | Total:
$
| |
532602B02500G
| Boyd |
HEATSINK TO-220 SOLDERPIN 38.1MM
| MPQ: 240 Lead Time: 9-12Days | -- -- | 4300 | Total:
$
| |
OMNI-UNI-18-50
| Wakefield-Vette |
HEATSINK 18X50MM TO-247 TO-264
| MPQ: 1000 Lead Time: 9-12Days | -- -- | 6400 | Total:
$
| |
ADUM5211CRSZ
| Analog Devices |
DGTL ISOLTR 2.5KV 2CH GP 20-SSOP
| MPQ: 66 Lead Time: 9-12Days | -- -- | 6000 | Total:
$
| |
374024B00035G
| Boyd |
HEATSINK BGA 23X23X10MM W/ADH
| MPQ: 480 Lead Time: 9-12Days | -- -- | 9900 | Total:
$
| |
ATS-CPX060060025-132-C1-R0
| Advanced Thermal Solutions Inc |
HEATSINK 60X60X25MM XCUT CP
| MPQ: 25 Lead Time: 9-12Days | -- -- | 8400 | Total:
$
| |
ADUM4400ARIZ
| Analog Devices |
DGTL ISOLTR 5KV 4CH GP 16-SOIC
| MPQ: 37 Lead Time: 9-12Days | -- -- | 7300 | Total:
$
| |
C247-025-1AE
| Ohmite |
HEATSINK FOR TO-247 WITH 1 CLIP
| MPQ: 70 Lead Time: 9-12Days | -- -- | 3600 | Total:
$
| |
901-19-2-12-2-B-0
| Wakefield-Vette |
HEATSINK 19X19X12MM PIN
| MPQ: 90 Lead Time: 9-12Days | -- -- | 1600 | Total:
$
|
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