Xilinx(Amd)
Profile:
Xilinx, a AMD company,pronounced as /ˈzaɪlɪŋks/ (zy-lingks), is a leading provider of programmable logic solutions based in the United States. Founded in 1984 in Silicon Valley, California, with its headquarters in San Jose, Xilinx has established branches in various locations, including Colorado, Ireland, Singapore, India, China, and Japan. The company is listed on NASDAQ with the ticker symbol XLNX. Xilinx is renowned for inventing the Field-Programmable Gate Array (FPGA), a technology that has revolutionized the programmable logic industry. From being a single FPGA enterprise, Xilinx has strategically transformed into a global leader in All Programmable FPGA, SoC, MPSoC, and 3D IC solutions. Xilinx integrates industry-leading devices with a new generation of design environments and IPs to meet the diverse needs of customers for programmable logic and even programmable system integration.
Part No. Manufacturer Description Lead Time Unit Price(USD) In Stock Quantity Operation
APF19-19-06CB
Cts
HEATSINK LOW-PROFILE FORGED

MPQ: 300

Lead Time: 9-12Days

-- --
7800
Total: $
TC621CVOA-VAO
Microchip
THERMOSTAT -40 TO 125C C

MPQ: 100

Lead Time: 9-12Days

-- --
6300
Total: $
901-19-1-12-2-B-0
Wakefield-Vette
HEATSINK 19X19X12MM ELLIPTICAL

MPQ: 90

Lead Time: 9-12Days

-- --
5800
Total: $
MCP9510HT-E/CHVAO
Microchip
THERMOSTAT PRG ACT HI/LO SOT23-6

MPQ: 3000

Lead Time: 9-12Days

-- --
7000
Total: $
PA-T2X-38E
Ohmite
PIN FIN HEATSINK

MPQ: 168

Lead Time: 9-12Days

-- --
600
Total: $
513202B02500G
Boyd
HEAT SINK

MPQ: 1000

Lead Time: 9-12Days

-- --
3500
Total: $
OMNI-UNI-30-50-D
Wakefield-Vette
HEATSINK TO-247 TO-264 TO-220

MPQ: 1000

Lead Time: 9-12Days

-- --
9300
Total: $
ATS-CPX035035035-180-C1-R0
Advanced Thermal Solutions Inc
HEATSINK 35X35X35MM R-TAB CP

MPQ: 25

Lead Time: 9-12Days

-- --
9000
Total: $
7025B-MTG
Boyd
HEATSINK TO-220 TAB FOLD 28.7MM

MPQ: 192

Lead Time: 9-12Days

-- --
4900
Total: $
V5583E
Assmann Wsw Components
HEATSINK ALUM ANOD

MPQ: 200

Lead Time: 9-12Days

-- --
8200
Total: $
533802B02500G
Boyd
BOARD LEVEL HEAT SINK

MPQ: 540

Lead Time: 9-12Days

-- --
4000
Total: $
BDN18-6CB/A01
Cts
HEATSINK CPU W/ADHESIVE 1.81"SQ

MPQ: 2000

Lead Time: 9-12Days

-- --
3300
Total: $
VM1-038-1AE
Ohmite
HEATSINK VERTICAL

MPQ: 10

Lead Time: 9-12Days

-- --
6700
Total: $
OMNI-UNI-18-25
Wakefield-Vette
HEATSINK 18X25MM TO-247 TO-264

MPQ: 1000

Lead Time: 9-12Days

-- --
6300
Total: $
501403B00000G
Boyd
HEAT SINK TO-3 .750" COMPACT

MPQ: 1000

Lead Time: 9-12Days

-- --
9400
Total: $
ATS-FPX025025010-73-C2-R0
Advanced Thermal Solutions Inc
HEATSINK 25X25X10MM R-TAB FP

MPQ: 25

Lead Time: 9-12Days

-- --
3200
Total: $
MAX6514UKP115+
Analog Devices
THERMOSTAT SOT23-5

MPQ: 1

Lead Time: 9-12Days

-- --
6800
Total: $
RA-T2X-64E
Ohmite
HEATSINK TO-218,TO-220,TO-247

MPQ: 210

Lead Time: 9-12Days

-- --
9900
Total: $
R2A-CT4-38E
Ohmite
HEATSINK FOR TO-247

MPQ: 50

Lead Time: 9-12Days

-- --
4900
Total: $
7128DG
Boyd
BOARD LEVEL HEATSINK .375"TO-220

MPQ: 1000

Lead Time: 9-12Days

-- --
2200
Total: $
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