Xilinx(Amd)
Profile:
Xilinx, a AMD company,pronounced as /ˈzaɪlɪŋks/ (zy-lingks), is a leading provider of programmable logic solutions based in the United States. Founded in 1984 in Silicon Valley, California, with its headquarters in San Jose, Xilinx has established branches in various locations, including Colorado, Ireland, Singapore, India, China, and Japan. The company is listed on NASDAQ with the ticker symbol XLNX. Xilinx is renowned for inventing the Field-Programmable Gate Array (FPGA), a technology that has revolutionized the programmable logic industry. From being a single FPGA enterprise, Xilinx has strategically transformed into a global leader in All Programmable FPGA, SoC, MPSoC, and 3D IC solutions. Xilinx integrates industry-leading devices with a new generation of design environments and IPs to meet the diverse needs of customers for programmable logic and even programmable system integration.
Part No. Manufacturer Description Lead Time Unit Price(USD) In Stock Quantity Operation
TMP01ESZ-REEL
Analog Devices
THERMOSTAT PROG ACT HIGH 8SOIC

MPQ: 2500

Lead Time: 9-12Days

-- --
4400
Total: $
ATS-EXL64-300-R0
Advanced Thermal Solutions Inc
HEATSINK AL6063 300X25X22MM

MPQ: 1

Lead Time: 9-12Days

-- --
9300
Total: $
LM57TSPWQ1
Texas Instruments
THERMOSTAT PROG ACT HI/LO 8TSSOP

MPQ: 150

Lead Time: 9-12Days

-- --
2300
Total: $
ATS-EXL1-254-R0
Advanced Thermal Solutions Inc
HEATSINK AL6063 254X100X10MM

MPQ: 1

Lead Time: 9-12Days

-- --
8500
Total: $
TMP390A2DRLT
Texas Instruments
THERMOSTAT PROG ACT LOW OPEN DRN

MPQ: 250

Lead Time: 9-12Days

-- --
1400
Total: $
TC621CEOA
Microchip
THERMOSTAT PROG ACT HIGH 8SOIC

MPQ: 100

Lead Time: 9-12Days

-- --
9200
Total: $
ATS-61270D-C1-R0
Advanced Thermal Solutions Inc
MAXIGRIP FANSINK 27X27X9.5MM

MPQ: 100

Lead Time: 9-12Days

-- --
9900
Total: $
ATS-1186-C1-R0
Advanced Thermal Solutions Inc
1/8 BRICK HEATSINK 23X58X22.9MM

MPQ: 100

Lead Time: 9-12Days

-- --
9500
Total: $
APF40-40-13CB/A01
Cts
HEATSINK FORGED W/ADHESIVE TAPE

MPQ: 100

Lead Time: 9-12Days

-- --
7200
Total: $
ATS-52310B-C1-R0
Advanced Thermal Solutions Inc
HEAT SINK 31MM X 31MM X 7.5MM

MPQ: 100

Lead Time: 9-12Days

-- --
7600
Total: $
BDN10-3CB/A01
Cts
HEATSINK CPU W/ADHESIVE 1.01"SQ

MPQ: 1320

Lead Time: 9-12Days

-- --
0
Total: $
TMP01FSZ
Analog Devices
THERMOSTAT PROG ACT HIGH 8SOIC

MPQ: 98

Lead Time: 9-12Days

-- --
6900
Total: $
624-45ABT3
Wakefield-Vette
HEATSINK CPU 21MM SQ W/ADH BLK

MPQ: 1600

Lead Time: 9-12Days

-- --
5600
Total: $
TMP303CDRLT
Texas Instruments
THERMOSTAT 60DEG ACT HI SOT563-6

MPQ: 250

Lead Time: 9-12Days

-- --
4100
Total: $
658-35AB
Wakefield-Vette
HEATSINK CPU 28MM SQBLK W/O TAPE

MPQ: 1000

Lead Time: 9-12Days

-- --
3900
Total: $
TC620CCPA
Microchip
THERMOSTAT PROG ACTIVE HIGH 8DIP

MPQ: 60

Lead Time: 9-12Days

-- --
5500
Total: $
7136DG
Boyd
BOARD LEVEL HEATSINK .515"TO-220

MPQ: 3000

Lead Time: 9-12Days

-- --
1400
Total: $
TC622EOA
Microchip
THERMOSTAT PROG ACT HIGH 8SOIC

MPQ: 100

Lead Time: 9-12Days

-- --
7300
Total: $
TC620HEOA
Microchip
THERMOSTAT PROG ACT HIGH 8SOIC

MPQ: 100

Lead Time: 9-12Days

-- --
2900
Total: $
TC621HEOA
Microchip
THERMOSTAT PROG ACTIVE LOW 8SOIC

MPQ: 100

Lead Time: 9-12Days

-- --
300
Total: $
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