Xilinx(Amd)
Profile:
Xilinx, a AMD company,pronounced as /ˈzaɪlɪŋks/ (zy-lingks), is a leading provider of programmable logic solutions based in the United States. Founded in 1984 in Silicon Valley, California, with its headquarters in San Jose, Xilinx has established branches in various locations, including Colorado, Ireland, Singapore, India, China, and Japan. The company is listed on NASDAQ with the ticker symbol XLNX. Xilinx is renowned for inventing the Field-Programmable Gate Array (FPGA), a technology that has revolutionized the programmable logic industry. From being a single FPGA enterprise, Xilinx has strategically transformed into a global leader in All Programmable FPGA, SoC, MPSoC, and 3D IC solutions. Xilinx integrates industry-leading devices with a new generation of design environments and IPs to meet the diverse needs of customers for programmable logic and even programmable system integration.
Part No. Manufacturer Description Lead Time Unit Price(USD) In Stock Quantity Operation
MAX14931CASE+
Analog Devices
DGTL ISOLTR 2.75KV 4CH GP 16SOIC

MPQ: 50

Lead Time: 9-12Days

-- --
1000
Total: $
ATS-H1-111-C2-R1
Advanced Thermal Solutions Inc
HEATSINK 60X60X9.5MM XCUT T766

MPQ: 25

Lead Time: 9-12Days

-- --
6600
Total: $
ATS-61425W-C1-R0
Advanced Thermal Solutions Inc
MAXIGRIP FANSINK 42.5X24.5MM

MPQ: 1

Lead Time: 9-12Days

-- --
5000
Total: $
MAX14131FAEE+
Analog Devices
DGTL ISOLTR 1KV 4CH GP 16-SSOP

MPQ: 100

Lead Time: 9-12Days

-- --
500
Total: $
ATS-61290R-C1-R0
Advanced Thermal Solutions Inc
MAXIGRIP FANSINK 29X29X19.5MM

MPQ: 100

Lead Time: 9-12Days

-- --
2300
Total: $
ISO7762QDBQQ1
Texas Instruments
DGTL ISOLTR 3KV 6CH CAN 16-SSOP

MPQ: 75

Lead Time: 9-12Days

-- --
6800
Total: $
ATS-P2-29-C2-R0
Advanced Thermal Solutions Inc
HEATSINK 70X70X20MM XCUT T766

MPQ: 25

Lead Time: 9-12Days

-- --
100
Total: $
ISO7762FQDBQQ1
Texas Instruments
DGTL ISOLTR 3KV 6CH CAN 16-SSOP

MPQ: 75

Lead Time: 9-12Days

-- --
6200
Total: $
SKV585811-CU
Wakefield-Vette
COPPER HEATSINK 57.9X59X11MM

MPQ: 100

Lead Time: 9-12Days

-- --
7000
Total: $
ISO7763QDBQQ1
Texas Instruments
DGTL ISOLTR 3KV 6CH CAN 16-SSOP

MPQ: 75

Lead Time: 9-12Days

-- --
3700
Total: $
ISO7763FQDBQQ1
Texas Instruments
DGTL ISOLTR 3KV 6CH CAN 16-SSOP

MPQ: 75

Lead Time: 9-12Days

-- --
9900
Total: $
SKV505014-CU
Wakefield-Vette
COPPER HEATSINK 50X50X14MM

MPQ: 100

Lead Time: 9-12Days

-- --
9700
Total: $
MAX14936BAWE+
Analog Devices
DGTL ISOLTR 5KV 4CH GP 16-SOIC

MPQ: 46

Lead Time: 9-12Days

-- --
800
Total: $
MAX22344CAAP+
Analog Devices
DGTL ISO 3.75KV 4CH CAN 20-SSOP

MPQ: 66

Lead Time: 9-12Days

-- --
4500
Total: $
ATS-51325R-C1-R0
Advanced Thermal Solutions Inc
HEAT SINK 32.5 X 32.5 X 19.5MM

MPQ: 100

Lead Time: 9-12Days

-- --
9600
Total: $
ADUM2200BRIZ
Analog Devices
DGTL ISOLTR 5KV 2CH GP 16-SOIC

MPQ: 37

Lead Time: 9-12Days

-- --
4700
Total: $
ATS-H1-25-C2-R0
Advanced Thermal Solutions Inc
HEATSINK 60X60X25MM XCUT T766

MPQ: 25

Lead Time: 9-12Days

-- --
3400
Total: $
ATS-51300R-C1-R0
Advanced Thermal Solutions Inc
HEAT SINK 30MM X 30MM X 19.5MM

MPQ: 100

Lead Time: 9-12Days

-- --
6900
Total: $
MAX14932FAWE+
Analog Devices
DGTL ISOLTR 2.75KV 4CH GP 16SOIC

MPQ: 46

Lead Time: 9-12Days

-- --
2700
Total: $
ATS-61330D-C1-R0
Advanced Thermal Solutions Inc
MAXIGRIP FANSINK 33X33X9.5MM

MPQ: 100

Lead Time: 9-12Days

-- --
5800
Total: $
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