Xilinx(Amd)
Profile:
Xilinx, a AMD company,pronounced as /ˈzaɪlɪŋks/ (zy-lingks), is a leading provider of programmable logic solutions based in the United States. Founded in 1984 in Silicon Valley, California, with its headquarters in San Jose, Xilinx has established branches in various locations, including Colorado, Ireland, Singapore, India, China, and Japan. The company is listed on NASDAQ with the ticker symbol XLNX. Xilinx is renowned for inventing the Field-Programmable Gate Array (FPGA), a technology that has revolutionized the programmable logic industry. From being a single FPGA enterprise, Xilinx has strategically transformed into a global leader in All Programmable FPGA, SoC, MPSoC, and 3D IC solutions. Xilinx integrates industry-leading devices with a new generation of design environments and IPs to meet the diverse needs of customers for programmable logic and even programmable system integration.
Part No. Manufacturer Description Lead Time Unit Price(USD) In Stock Quantity Operation
ATS-54350R-C1-R0
Advanced Thermal Solutions Inc
HEAT SINK 35MM X 35MM X 19.5MM

MPQ: 100

Lead Time: 9-12Days

-- --
9900
Total: $
TG-CJ-LI-60-60-15-PF
T-Global Technology
HEATSINK CER 60X60X15MM W/TAPE

MPQ: 1

Lead Time: 9-12Days

-- --
3200
Total: $
ATS-EXL58-300-R0
Advanced Thermal Solutions Inc
HEATSINK AL6063 300X6X8MM

MPQ: 1

Lead Time: 9-12Days

-- --
6900
Total: $
375024B00032G
Boyd
HEATSINK BGA W/ADHESIVE TAPE

MPQ: 450

Lead Time: 9-12Days

-- --
8700
Total: $
ADUM5211BRSZ
Analog Devices
DGTL ISOLTR 2.5KV 2CH GP 20-SSOP

MPQ: 66

Lead Time: 9-12Days

-- --
6200
Total: $
ADUM3154BRSZ
Analog Devices
DGTL ISO 3.75KV 4CH SPI 20-SSOP

MPQ: 66

Lead Time: 9-12Days

-- --
7600
Total: $
APF40-40-13CB
Cts
HEATSINK LOW-PROFILE FORGED

MPQ: 300

Lead Time: 9-12Days

-- --
7100
Total: $
ADUM3471ARSZ
Analog Devices
DGTL ISOLTR 2.5KV 4CH GP 20-SSOP

MPQ: 66

Lead Time: 9-12Days

-- --
3700
Total: $
ATS-52230B-C1-R0
Advanced Thermal Solutions Inc
HEAT SINK 23MM X 23MM X 7.5MM

MPQ: 100

Lead Time: 9-12Days

-- --
3600
Total: $
ADUM1200WURZ
Analog Devices
DGTL ISOLTR 2.5KV 2CH GP 8-SOIC

MPQ: 98

Lead Time: 9-12Days

-- --
6200
Total: $
ISO35DW
Texas Instruments
DG ISO 2.5KV 3CH RS422 16-SOIC

MPQ: 40

Lead Time: 9-12Days

-- --
3100
Total: $
MAX14938GWE+
Analog Devices
DG ISO 2.75KV 3CH RS485 16-SOIC

MPQ: 46

Lead Time: 9-12Days

-- --
5700
Total: $
532602B02500G
Boyd
HEATSINK TO-220 SOLDERPIN 38.1MM

MPQ: 240

Lead Time: 9-12Days

-- --
4300
Total: $
OMNI-UNI-18-50
Wakefield-Vette
HEATSINK 18X50MM TO-247 TO-264

MPQ: 1000

Lead Time: 9-12Days

-- --
6400
Total: $
ADUM5211CRSZ
Analog Devices
DGTL ISOLTR 2.5KV 2CH GP 20-SSOP

MPQ: 66

Lead Time: 9-12Days

-- --
6000
Total: $
374024B00035G
Boyd
HEATSINK BGA 23X23X10MM W/ADH

MPQ: 480

Lead Time: 9-12Days

-- --
9900
Total: $
ATS-CPX060060025-132-C1-R0
Advanced Thermal Solutions Inc
HEATSINK 60X60X25MM XCUT CP

MPQ: 25

Lead Time: 9-12Days

-- --
8400
Total: $
ADUM4400ARIZ
Analog Devices
DGTL ISOLTR 5KV 4CH GP 16-SOIC

MPQ: 37

Lead Time: 9-12Days

-- --
7300
Total: $
C247-025-1AE
Ohmite
HEATSINK FOR TO-247 WITH 1 CLIP

MPQ: 70

Lead Time: 9-12Days

-- --
3600
Total: $
901-19-2-12-2-B-0
Wakefield-Vette
HEATSINK 19X19X12MM PIN

MPQ: 90

Lead Time: 9-12Days

-- --
1600
Total: $
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