Analog Devices
Profile:
Analog Devices is a leading supplier of data conversion and signal processing technologies in the world. The company is committed to providing the high-performance products and solutions in the fields of communications infrastructure, industrial automation, industrial instrumentation, automotive electronics, and healthcare.
Part No. Manufacturer Description Lead Time Unit Price(USD) In Stock Quantity Operation
MKP385E3122BKI02W0
Vishay
CAP FILM 0.012UF 10% 2.5KVDC RAD

MPQ: 300

Lead Time: 9-12Days

-- --
2300
Total: $
ATS-PCBT1086
Advanced Thermal Solutions Inc
HEATSINK TO-220 W/TAB BLACK

MPQ: 100

Lead Time: 9-12Days

-- --
900
Total: $
634-10ABP
Wakefield-Vette
HEATSINK TO-220 VERT MT BLK 1"

MPQ: 1100

Lead Time: 9-12Days

-- --
8300
Total: $
MKP385E3222AKF02W0
Vishay
CAP FILM 0.022UF 10% 2KVDC RAD

MPQ: 550

Lead Time: 9-12Days

-- --
9200
Total: $
MKP385E41212KII2B0
Vishay
CAP FILM 0.12UF 10% 1.25KVDC RAD

MPQ: 200

Lead Time: 9-12Days

-- --
7700
Total: $
ATS-PCBT1080
Advanced Thermal Solutions Inc
HEATSINK TO-218/TO-220 BLACK

MPQ: 100

Lead Time: 9-12Days

-- --
3200
Total: $
MKP385E41212KIM2T0
Vishay
CAP FILM 0.12UF 10% 1.25KVDC RAD

MPQ: 150

Lead Time: 9-12Days

-- --
5300
Total: $
HSE-B18254-0396H
Cui Devices
HEAT SINK, EXTRUSION,TO-218, 25.

MPQ: 600

Lead Time: 9-12Days

-- --
1500
Total: $
DTC114TCAHZGT116
Rohm Semiconductor
TRANS PREBIAS NPN 50V 0.1A SST3

MPQ: 3000

Lead Time: 9-12Days

-- --
6000
Total: $
MKP385E41212KIP2T0
Vishay
CAP FILM 0.12UF 10% 1.25KVDC RAD

MPQ: 150

Lead Time: 9-12Days

-- --
8100
Total: $
HSE-B18254-035H-00
Cui Devices
HEAT SINK, EXTRUSION, TO-218, 25

MPQ: 750

Lead Time: 9-12Days

-- --
6400
Total: $
DTC124EUBHZGTL
Rohm Semiconductor
TRANS PREBIAS NPN 0.1A UMT3F

MPQ: 3000

Lead Time: 9-12Days

-- --
5300
Total: $
MKP385E3272AJI02W0
Vishay
CAP FILM 0.027UF 5% 2KVDC RAD

MPQ: 350

Lead Time: 9-12Days

-- --
9400
Total: $
ATS-PCBT1077
Advanced Thermal Solutions Inc
HEATSINK TO-220 BLACK W/TAB

MPQ: 100

Lead Time: 9-12Days

-- --
7200
Total: $
MKP385E38212JI02W0
Vishay
CAP FILM 0.08UF 5% 1.25KVDC RAD

MPQ: 350

Lead Time: 9-12Days

-- --
4200
Total: $
HSE-B18254-035H
Cui Devices
HEAT SINK, EXTRUSION, TO-218, 25

MPQ: 750

Lead Time: 9-12Days

-- --
9700
Total: $
DTC143EUBHZGTL
Rohm Semiconductor
TRANS PREBIAS NPN 0.1A UMT3F

MPQ: 3000

Lead Time: 9-12Days

-- --
6300
Total: $
F340Y235630MFI2B0
Vishay
CAP FILM 0.056UF 20% 1KVDC RAD

MPQ: 500

Lead Time: 9-12Days

-- --
9800
Total: $
DTC144EUBHZGTL
Rohm Semiconductor
TRANS PREBIAS NPN 0.1A UMT3F

MPQ: 3000

Lead Time: 9-12Days

-- --
8900
Total: $
HSE-B20250-045H
Cui Devices
HEAT SINK, EXTRUSION, TO-220, 50

MPQ: 1080

Lead Time: 9-12Days

-- --
4100
Total: $
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